Phenolic Laminates
Phenolic Laminates
ISO 9001 Certified A216926
ISO 9001 Certified A216926
Underwriters Laboratories
Underwriters Laboratories
 

Phenolic Resin Back-up Laminate SD-737:俗稱 墊板、尿素板、鑽孔板、PCB鑽孔板
 
The main application for phenolic resin back-up boards is as the protective entry or back-up board while drilling or routing of flexible and/or rigid printed circuit boards (PCB).
 
Designations Characteristics & Applications Fabricating Suitability Minimum Diameter for Drilling (mm)
SD-737 For PCB drilling entry or back-up use, low percentage of warp and twist No smear or burr occurrence while drilling ≧0.15φ
 
Designations Standard Thickness (mm) Thickness Tolerance (mm) Standard Dimensions (mm)
SD-737 1.5 +0.1/-0 (S)942×1245
(M)1042×1245
(L)1092×1245
 
Typical Properties Test Method Condition(1) Unit Value
SD-737
Resin - - - Phenolic Resin
Composition - - - Kraft Paper
Standard Colour - - - Brown
Specific Gravity JIS-K6911 - - 1.38~1.44
Heat Resistance 120 Minutes at 120 ℃ A - No Change
Flexural Strength (Crosswise) MD JIS-K6911 A Kgf/mm2 ≧13.0
CD ≧11.0
Water Absorption JIS-K6911 E-24/50+D-24/23 g/200cm2 ≦2.0
Percentage of Warp and Twist JIS-K6911 A % ≦0.9
Hardness, Shore D JIS-K7215 A ° 90±2
Storage - - 5~40
- RH % 50~80
 
※The heavy metal content of this product tested by the Environmental Affairs Department is in accordance with the National Standard.
 
 

(1) The alphabet in condition indicates the kind of conditioning of specimen.
A: as received without conditioning.
C: conditioned in air under constant temperature and humidity.
D: immersed in water under constant temperature.
E: conditioned in air under constant temperature.
O: immersed in oil under constant temperature.

The first figure is the conditioning time(hours),the second figure is the conditioning temperature(℃) and the third figure is the conditioning relative humidity(%).