The main application for phenolic resin back-up boards is as the protective entry or back-up board while drilling or routing of flexible and/or rigid printed circuit boards (PCB).
The typical properties and standard supplying dimensions of Syndyne’s phenolic resin back-up boards are as follows:
Designations | Characteristics & Applications | Fabricating Suitability | Minimum Diameter for Drilling (mm) |
SD-BU26 | For BGA drilling entry or back-up use,low percentage of warp and twist | No smear or burr occurrence while drilling | ≧0.15φ |
SD-BU27 | For PCB drilling entry or back-up use, low percentage of warp and twist | No smear or burr occurrence while drilling | ≧0.2φ |
SD-BU45 | For BGA drilling entry or back-up use, low percentage of warp and twist | No smear or burr occurrence while drilling | ≧0.10φ |
Designations | Standard Thickness (mm) | Thickness Tolerance (mm) | Standard Dimensions (mm) |
SD-BU26 | +1.5/-0.1 | ±0.05 | (S)942×1245 (M)1042×1245 (L)1092×1245 |
SD-BU27 | 1.5 2.0 | ±0.1 ±0.1 | (S)942×1245 (M)1042×1245 (L)1092×1245 |
SD-BU45 | 1.5 | ±0.05 | (S)942×1245 (M)1042×1245 (L)1092×1245 |